Effect of Sputter Deposition on the Adhesion and Failure Behavior between Cu Film and Glassy Calcium Aluminosilicate: A Molecular Dynamics Study

Understanding the physical vapor deposition (PVD) process of metallic coatings on an inorganic substrate is essential for packaging and semiconductor industry. In this work, we investigate a Copper (Cu) film glassy Calcium Aluminosilicate (CAS) by PVD its dependence incident energy. Molecular dynamics simulation adopted to mimic process, pure Cu grown top CAS surface forming intermixing region (IR) oxide. initial stage deposition, atoms are diffused into bulk aggregated at which leads formation IR. When high energy, 2 eV, applied, 20% more observed interface compared low 0.2 due enhanced lateral diffusion. As grows, amorphous thin layer 1 nm temporarily formed CAS, crystallization with face-centered cubic from structure follows regardless roughness be energy cases. Deformation failure behavior Cu-CAS bilayer pulling investigated steered molecular technique. The adhesive mode observed, implies experiences interface, 7% higher adhesion force predicted case. To find origin enhancement, distribution fractured analyzed, it turns out that 6.3% remain surface, can regarded as source force. Our findings hopefully give insight understand mechanisms between heterogeneous materials also helping further improve in sputter experiments.